Used SPEEDFAM 48 GPAW-III #293672263 for sale

ID: 293672263
Vintage: 2010
Single-sided polisher 2010 vintage.
SPEEDFAM 48 GPAW-III wafer grinding, lapping & polishing equipment is a fully automated system that specializes in the polishing, grinding, and lapping of semiconductor wafers and other components. It is a highly effective unit that provides efficient, high quality results, producing defect-free, glossy surfaces quickly and efficiently. The machine includes a wide variety of tools such as full-range grinding wheels, wafer carriers, lapping disks, and polishing pads that are designed to handle a variety of complex substrate geometries and materials including silicon, gallium arsenide, and gallium nitride. All tools are self-aligning, providing accurate and reliable results. Additionally, a range of lapping speeds and force controls are available to optimize the process for each application. To further increase efficiency, automatic loading/unloading of wafers is included with the tool, significantly reducing setup and adjustment times. By eliminating the manual loading of wafers, the risk of scratching the wafers is greatly reduced. In addition to the automated loading/unloading process, there is a nozzle cleaning asset to ensure the highest quality results. 48 GPAW-III is programmed with an intuitive graphical user interface that enables simple keypad or mouse controlled operations throughout the process. Parameters such as lapping speed, pressure, and tool selection can be adjusted in real-time to improve accuracy and reliability. The model also features a comprehensive range of metrology and control systems, including real-time wafer surface measurement and surface-stress sensing technologies, which helps to minimize the risk of defected wafers. Additionally, the built-in safety and environmental protection features ensure a safe and sustainable operation. SPEEDFAM 48 GPAW-III is designed to provide consistent and repeatable results, even when handling complex substrates. With its flexibility, reliability, and superior performance, this wafer grinding, lapping & polishing equipment is an ideal choice for a wide variety of applications.
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