Used SPEEDFAM 48 GPAW-III #9355288 for sale
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ID: 9355288
Vintage: 2010
Single-sided polisher
Surface plate diameter: φ1219
Pressure plate: φ457
Power requirements: 200V, 3 Phase, 50/60 Hz
2010 vintage.
SPEEDFAM 48 GPAW-III is a precision machining equipment designed for use in the wafer grinding, lapping, and polishing process. It is constructed using a heavy-duty frame that houses a variety of components essential for wafer machining, including four grinding units, four lapping units, and four polishing units. Each unit includes the necessary tools, abrasives, and machinery parts needed to complete each task, from grinding and lapping to polishing. All are connected to the main control panel, located on the platform of the machine. 48 GPAW-III utilizes a computer-controlled panel system to monitor and control the different machining processes. This panel displays the current machine operation, the status of the abrasives, and other useful information to operators. When a process requires grinding, lapping, or polishing, the machine is set to the appropriate mode and abrasives are dispensed accordingly. The entire process is digitally controlled and automated, resulting in reduced human intervention and greater accuracy. SPEEDFAM 48 GPAW-III also features a safety unit designed to protect operators from harmful grinding particles and debris. To prevent excessive grinding, the machine is equipped with a pressure protection machine that allows it to softly start up and shut down. It also contains sensors for the presence and distance of the grinding wheel, which prevents it from coming into contact with any materials other than the wafers being machined. The machine performs exceptionally well and is capable of producing superior results. With improved levels of accuracy and precision, it guarantees consistent performance and consistent results. 48 GPAW-III is highly reliable and can be used with all types of abrasives and materials, making it a must-have tool for the wafer grinding, lapping, and polishing process.
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