Used SPEEDFAM 48 GPAW #293672261 for sale

SPEEDFAM 48 GPAW equipment is an advanced wafer grinding, lapping and polishing system, designed specifically for in-line automation of wafer grinding, lapping and polishing operations. This unit offers high precision grinding, lapping and polishing, with quality and repeatability, without the need for high manpower for each process. As Full-Automation Wafer Processing Equipment, the process is carried out automatically for up to 8 wafer sizes from 150mm to 8" for a variety of materials and specifications, eliminating any human errors, such as operator fatigue and clumsiness, during the process. The machine consists of wafer holders for holding the wafers securely whilst in operation, two-stage grinding heads to rapidly grind wafers to precise sizes, two polishing heads utilising a diamond slurry to polish the wafers and four buffing and polishing heads. The grinding, lapping and polishing heads of the tool are designed to move independently in all directions, ensuring superior grinding and polishing consistency, while its high-speed spindle allows for much shorter cycle times and repeatable results of the finished product. Chatter marks are avoided with the use of vibration damping and stiff asset components, maintaining precision even with heavier loads, and 8-inches of grinding range ensures the model can process a variety of wafers with limited unnecessary transport of each wafer-holder. High cutting forces and low temperature rise are ensured by supplying liquid cooling of the grinding wheel, laser monitoring of cutting force, and a liquid chiller to cool the spindle. SPEEDFAM 48GPAW equipment also offers a wafer centering capability, enabling perfect registration of wafers, and an automatic positional adjustment for accurate centering of the wafers during the grinding, lapping and polishing processes. Furthermore, a full monitoring system serves as a quality assurance tool, with which the user can monitor cutting temperatures and force. In conclusion, 48 GPAW unit is an ideal solution for those looking for a complete wafer grinding, lapping and polishing machine with superior repeatability and processing accuracy. Ultimately, the combination of innovative designs, precise grinding, lapping and polishing techniques, optical monitoring, and automated processes ensure that 48GPAW is an effective and efficient way to process wafers.