Used SPEEDFAM 48 GPAW #293672266 for sale

SPEEDFAM 48 GPAW is a high performance wafer grinding, lapping, and polishing equipment that is both compact and flexible. The system is designed to improve the accuracy and quality of semiconductor wafers and other related items. The unit consists of three main components: a spindle, a grinding head, and a polishing head. The spindle is a high speed, precision driven motor capable of driving a grinding head at variable speeds up to 6000 rpm for grinding and polishing operations. The grinding head is designed to perform surface and/or edge preparation of wafers with very low vibration levels and high removal rates withstood moderate force. It can also be used to grind and lap various kinds of crystals, ferrites, and ceramic substrates. The polishing head is mounted on the spindle and is designed to create a fine finish on the surface for the precise microstructural control. SPEEDFAM 48GPAW is equipped with an LCD display that allows the user to monitor the motor speed and grinding head position, thus ensuring that the wafer is accurately processed. The machine also includes a vacuum cleaner unit with a separate dust collection tool for efficient cleaning of chips produced in the grinding process. Finally, a cleaning liquid supply mechanism is included to reduce the amount of dust maintained during the grinding process. 48 GPAW is an ideal choice for industries that require precise control of wafer properties, such as photonics or microelectronics. It is also useful for users who need to process small wafers with high precision and high removal rates. The asset is easy to use and is designed to provide excellent results every time, regardless of the material or type of wafer being worked on.