Used SPEEDFAM 48 #9212913 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
![Loading](/img/loader.gif)
Sold
ID: 9212913
Lapping system
Diameter: 1200 mm
(4) Rings mechanically driven
Pressure devices.
SPEEDFAM 48 wafer grinding, lapping, and polishing equipment (GPL-48) is a multi-functional CNC system designed to smooth the surface of wafers, and other substrates, to achieve homogeneity and surface accuracy. This unit comes with a wide array of features that make it suitable for a variety of tasks. The GPL-SPEEDFAM 48 works by utilizing a grinding disc with diamond abrasive wheels that spin around the substrate. The diamonds are chosen based on their particular hardness and shape. This action removes material from the surface of the wafer, providing the desired results. The GPL-48 machine also includes a polishing disc to further refine the surface. The GPP-SPEEDFAM 48 is equipped with Computer Numerical Control (CNC) abilities, making it easy to automate the grinding, lapping, and polishing process. This tool also offers a motion controller and a range of communication protocols that can make complex jobs easier. 48 asset is composed of two main components - the processor and the grinding or polishing tables. The processor is responsible for controlling the motion and collecting data from various sensors, while the tables support the wafers and rotate them during the process. The model can be used in a variety of industries, from the semiconductor industry, to medical device and biotechnological companies. It can grind, lap, and polish various materials, including titanium, stainless steel, copper, tungsten alloys, and polycarbonate. Other features of the GPP-SPEEDFAM 48 that make it even more versatile include its high speed and precision, its ability to adapt to changing conditions, and its efficient dust collection equipment. It is also designed for safety, and it can be programmed to provide warnings and alarms in case of danger. In short, 48 wafer grinding, lapping, and polishing system is a versatile and powerful tool for those who need to create a smooth and even surface on wafers or other substrates. Its many features and capabilities make it well suited for a variety of tasks in a variety of industries.
There are no reviews yet