Used SPEEDFAM 48BTAW #9199491 for sale

SPEEDFAM 48BTAW is a state-of-the-art wafer grinding, lapping and polishing equipment designed for use in semiconductor and other precision device manufacturing applications. It provides superior surface finish and uniformity with its optimized abrasive grinding capabilities and exceptionally low vibration characteristics, allowing for maximum throughput and production yield. The system includes a multi-stage 3-speed operation that allows for precise control and adjustment of the wafer's shape and surface finish utilizing a combination of grinding and polishing wheels. This process enables precise lapping, grinding, and polishing of various materials, including silicon, quartz, raw materials, and wafers. 48BTAW has a high-precision flat spindle drive for smooth and accurate workpiece feed and high-speed operations, ensuring optimal control and accuracy throughout operation. The built-in computer-controlled process capabilities allow for speed, feed, and coolant adjustments for repeatable results. A user-friendly operator interface can easily select the desired grinding parameters, and the LCD panel displays the parameters in both graphical and numerical form for easy viewing and interpretation. The unit is also equipped with several safety features, including a comprehensive signal output safety machine and a noise chamber with shock-resistant walls to safeguard personnel in the vicinity of the work area. SPEEDFAM 48BTAW is equipped with a robust auto-stop motion control feature and failsafe braking tool to prevent damage to the grinding wheel and the workpiece during operation. This asset also has advanced temperature control capabilities to ensure optimal grinding wheel temperature and an in-built sealed coolant model to cool the wheel during operation and provide cleanliness. In addition, the equipment includes a number of other features such as a particle size distributor and automatic wheel overdrive protection. Overall, 48BTAW is an efficient and reliable wafer grinding, lapping and polishing system that provides superior surface finish and uniformity with its optimized abrasive grinding capabilities and exceptionally low vibration characteristics. This unit is the perfect solution for any wafer grinding, lapping and polishing application, and has been designed for maximum throughput and production yield.