Used SPEEDFAM 48KGPAW #9147806 for sale

SPEEDFAM 48KGPAW wafer grinding, lapping and polishing equipment is a high-quality and high-precision tool used to create thin and flat surfaces on substrates. This system is beneficial for texturing and shaping substrates for specific applications, as it can be used for a wide range of materials such as crystals, glasses, ceramics, and metals. The unit consists of a 50LC-6 lapping machine, a HTG-3 grinding machine, a LCP-4 polishing machine, and a 30SHJS slicing machine. The 50LC-6 lapping machine is a high-precision tool that uses abrasive materials, such as diamond lapping film, to create the desired surface on the substrate. It features a computer-controlled machine with adjustable speed settings, a tilting table, and integrated coolant tool. It can be programmed to process multiple substrates at once and can be used for wafers ranging in size from 2 to 10 inches. The HTG-3 grinding machine is a heavy-duty tool that uses diamond wheels to effectively sand and grind surfaces. It is made with a high-torque motor and features an adjustable speed dial, as well as a manual feed and a coolant asset. The machine can be used to create rough cuts, level surfaces, and narrow grooves, thin ribs, or even sharp edges on the substrate. It can process substrates of various sizes with a maximum thickness of up to 8mm. The LCP-4 polishing machine is a precision tool used to create high-quality, ultra-flat surfaces on the substrate. This machine has high-torque drive motors and is equipped with an auto feeder that helps to speed up and streamline the process. It can process a variety of materials and substrates with a maximum thickness of 4mm. The machine also features a computer-controlled model that can be programmed for different operations. Finally, the 30SHJS slicing machine is a sophisticated machine that uses blades to precisely cut wafers. It features adjustable speed and positioning, and an integrated coolant equipment to help regulate the temperature. It is also equipped with a computer-controlled system that can be programmed for various types of cuts and thicknesses. 48KGPAW wafer grinding, lapping and polishing unit is an efficient and reliable tool for a variety of wafer grinding, lapping, and polishing operations. It has versatile and precise features that allow for a wide range of applications and materials. Its powerful motor and computer-controlled systems make it a reliable and efficient machine for creating thin, flat surfaces.