Used SPEEDFAM 4GPAW #9208831 for sale
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SPEEDFAM 4GPAW is a highly advanced wafer grinding, lapping & polishing equipment designed to meet the precise needs of the semiconductor, opto-electronics and medical device industries. It is capable of grinding, lapping & polishing a wide range of wafers and substrates, such as silicon, sapphire, germanium, SiC and ceramic substrates. The reliable and repeatable process of 4GPAW allows for grinding, lapping and polishing wafers to the highest standards of surface finish and tolerance. SPEEDFAM 4GPAW utilizes a unique hollow stone grinding technology with an adjustable grinding pressure. This grinding technology allows for the efficient removal of material and the controlled precision grinding of ultra-thin wafers in a single step. Through the use of a unique low-force contact style, very little damage or contamination is caused to the wafer surface. 4GPAW system also utilizes a top-of-the-line lapping and polishing unit. This machine is capable of processing a wide range of wafers and offers excellent repeatibility and repeatable results. SPEEDFAM 4GPAW also offers the capability of performing multiple lapping processes in one step. This eliminates the need for multiple lapping processes, saving time and money. 4GPAW also offers a fully automated particle collection tool. This asset allows for the collection of particles or contamination that can potentially damage wafers. The model is capable of automatically separating particles according to size, shape, and composition and the particles are collected by SPEEDFAM 4GPAW for periodic maintenance. 4GPAW is capable of delivering unparalleled quality and performance. Through its unique hollow stone grinding technology, it is capable of grinding, lapping and polishing a wide range of wafers and substrates to the highest standards of surface finish and tolerance. It is also capable of performing multiple lapping processes in one step and the on-board particle collection equipment greatly increases the performance and reliability of the system. SPEEDFAM 4GPAW is an ideal solution for the requirement of high quality, repeatable and cost effective wafer grinding, lapping and polishing.
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