Used SPEEDFAM 50 DPAW #9294580 for sale

SPEEDFAM 50 DPAW is a wafer grinding, lapping and polishing equipment used for the processing of semiconductor materials like Si, SiGe, GaAs and glass substrates. This system is capable of grinding, lapping and polishing hard and complex materials with great accuracy and finish. It is used in various industries such as microelectronics, hard disk media, medical devices, micro-optics, fiber optics, and flat panel displays. 50 DPAW features an advanced DPAW unit which is a patented tool for accurately controlling the grinding, lapping and polishing process. This machine uses an automated, computerized tool to regulate both the acceleration and support arm position. It features an oscillation speed of 5000 rpm, a lap diameter of up to 12" (30 cm), and a lapping disk of up to 8" (20 cm). SPEEDFAM 50 DPAW is used for electroplating, backlapping, and edge rounding of wafers. It is capable of polishing materials such as SiC, graphite and diamond, as well as providing surface polish and finishing of high-precision parts. This asset has the ability to automatically adjust to the type of material being lapped in order to produce uniform surfaces. It can also be used to remove surface roughness and cut or shape grooves. This model is equipped with a spindle drive power section which has adjustable frequency and a step-down control feature, a vacuum equipment for dust collection, and a central console for efficient control of lapping and polishing operations. It has a computer programming interface and the ability to control the force, speed, clarity, and number of lapping passes. 50 DPAW system is designed to be user-friendly and requires minimal maintenance. It is a reliable, durable and efficient solution for applications related to lapping, polishing, and grinding of semiconductor and optoelectronic material.