Used SPEEDFAM 50 DPAW #9294583 for sale

SPEEDFAM 50 DPAW is a wafer grinding, lapping and polishing equipment used for production of semiconductor wafers. It is a fully automated system that includes a loader/unloader, grinding, lapping and polishing heads, wafer handling, and a loop control unit. It is designed to process a single wafer at a time and is capable of lapping and polishing the wafer to very tight control requirements. 50 DPAW utilizes an automated loader/unloader that can manage up to 40 wafers at a time. The wafers are loaded into the machine individually and then unloaded once they have been processed. Additionally, the tool has a robotic wafer handling arm that transports the wafer from the loader/unloader to the other components of the asset. The grinding head is the first component that processes the wafer. It uses a special grinding wheel to reduce the thickness of the wafer and to ensure the wafer is flat and smooth. The process is controlled by a computer model which monitors the progress of the grinding as well as the temperature of the grinding wheel. Once the grinding is complete, the lapping and polishing heads are used to further refine the surface of the wafer. The lapping head is used to create a flat and smooth surface, while the polishing head is used toperfect the surface finish. The process is again monitored by a computer equipment which tracks the progress of the lapping and polishing. Once complete, the wafer is transported by the wafer handling arm back to the loader/unloader for unloading. Finally, SPEEDFAM 50 DPAW also includes a loop control system. This unit is used to monitor the temperature, humidity and pressure of the machine and to ensure that they are all within the required specifications. The loop control tool is also responsible for controlling the speed of the grinding and lapping/polishing heads. Overall, 50 DPAW is an automated wafer grinding, lapping and polishing asset used to produce semiconductor wafers. It is designed to process the wafer in a single pass and is capable of lapping and polishing the wafer to very tight control requirements. The model includes a robotic wafer handling arm, a loop control equipment, and is monitored by a computer system to ensure optimal performance.