Used SPEEDFAM 50 DPAW #9363678 for sale

SPEEDFAM 50 DPAW Wafer Grinding, Lapping and Polishing Equipment is a comprehensive, customizable system that offers maximum efficiency for processing both hard and soft materials. This unit is designed to process wafers into precise semiconductor components. Using a combination of belt grinding, lapping, and polishing, the machine is capable of achieving high quality finishes for a variety of components. The tool consists of a series of motorized spindles for controlled rotation of the grinding and polishing media that is mounted onto a belt asset. An automated 50-inch diameter table is scored and pre-treated to reduce defects on the wafers and is coated with a velvet-like resilient backing to provide superior surface lapping. The spindles are rigid and accurately positioned perpendicular to the grinding and polishing media. This unique feature ensures optimal stock removal and minimizes variation in the finished product. 50 DPAW utilizes an abrasive polishing wheel to achieve a long-lasting, uniform finish. The abrasive media is selected depending on the desired finish required. The polishing wheel will have either analytical grit (0-800) for low roughness, or fine grit (800-1500) for higher. Additionally, an in-process monitoring model is included to provide real-time monitoring of wafer progress. This equipment utilizes optical microscopy to view the sample in real-time, allowing for quality analysis of the finished product. The system also includes a variety of lapping fluids and lubricants, allowing for efficient cleaning and degreasing of the wafers. An auto-tensioning unit is also included to ensure precise media tension and repeatable performance. SPEEDFAM 50 DPAW is designed for maximum process efficiency, with an adjustable process rate and repeatable conditions. This machine also includes other industry-leading features for quick wafer processing and a high return on investment. 50 DPAW is ideal for high-precision semiconductor applications and is sure to exceed customer demands.