Used SPEEDFAM 50 DPAW #9363680 for sale

SPEEDFAM 50 Dual-Plane Abrasive Wheel (DPAW) wafer grinding, lapping and polishing equipment offers advanced technology and an optimal solution for semiconductor processing. This system features an optimized dual-plane design for easy operation and provides optimum results for processing semiconductor wafers of various sizes and substrates. The DPAW unit is engineered to provide excellent control over grinding and polishing parameters, eliminating the need for multiple changes when dealing with different materials or fine tuning for specific applications. The machine operates with a dual-plane design, which utilizes two simultaneous grinding wheels for optimal grinding and lapping performance. The DPAW makes use of an adjustable power feed to ensure proper grinding forces in either direction. This feature allows for a much higher level of control when dealing with delicate materials like semiconductor wafers. For more uniform results, the tool also utilizes a flexible, high-torque grinding spindle powered by a programmable frequency inverter. This guarantees uniform grinding speeds and forces, regardless of wafer thickness or diameter. The programming and operation of SPEEDFAM 50 DPAW asset is easy and intuitive, and can be done through a graphical user interface. This interface allows for several parameters to be set, such as grinding speed, direction and force, as well as features like digital dynamic compensation to provide maximum uniformity of grind. The model allows for the user to monitor, control and record all the key processing parameters, such as grit-to-grit velocity, abrasive concentration, and total grinding time, on the touchscreen panel. Additionally, the equipment can be configured with additional advanced features, such as automatic parameter control and an integrated self-calibration system. Finally, the DPAW unit is highly reliable and consistent in its performance, due to its robust mechanical design and advanced technology. The heavy-duty, steel-reinforced construction offers superior durability and vibration-damping to increase the life of the machine and ensure repeatable accuracy. The machine is also designed to be maintenance-free, with easy-to-access cleaning points to keep it running optimally for a long time. With its advanced, user-friendly design, 50 DPAW tool provides an optimal solution for semiconductor processing applications.