Used SPEEDFAM 50 GPAW-TD #9377482 for sale

SPEEDFAM 50 GPAW-TD is a professional wafer grinding, lapping and polishing equipment designed to meet the demanding requirements of high volume semiconductor production. This system provides the precision and reliability needed for both surface preparation and post-polishing applications. 50 GPAW-TD is capable of grinding and polishing a variety of different wafer sizes up to 200 mm in diameter. The exceptionally high degree of accuracy and repeatability achieved by this unit makes it ideal for demanding precision jobs, such as grinding flat silicon wafers and preparing them for subsequent device fabrication. SPEEDFAM 50 GPAW-TD utilizes a state-of-the-art grinding and polishing machine, combining high-efficiency and speed while maintaining excellent surface finishes. The tool is equipped with various interchangeable grinding and polishing heads with different grain sizes, making it easy to tailor the process to the needs of a specific application. A robust spindle motor and linear drive provide reliable operation even under constant load conditions, ensuring precise results. The patented air bearing stator drive allows the machine to move rapidly, while maintaining a steady rpm. The large working area of 50 GPAW-TD makes it perfect for large-scale production jobs. It provides simultaneous grinding and polishing operations on each wafer, cutting cycle times dramatically. The large ultrasonic chamber permits multiple wafers to be worked on at one time, a unique feature only found on SPEEDFAM 50 GPAW-TD. In addition to its superior performance, 50 GPAW-TD is designed for easy operation and reduced operator fatigue. Its modern control interface has a range of user-friendly features, including auto-shutoff for unattended workflows and preset process parameters that can be stored and recalled for future use. The asset also includes advanced safety systems, such as an electrical interlock for the protective cover and an emergency power shutoff switch. SPEEDFAM 50 GPAW-TD is a powerful, reliable and cost-effective solution for all your wafer grinding, lapping and polishing needs. Its precise, repeatable results and excellent surface finishes make it an ideal solution for both large-scale production and precision post-polish applications.