Used SPEEDFAM 50 GPAW-TD #9377484 for sale

SPEEDFAM 50 GPAW-TD is a high precision wafer grinding, lapping and polishing equipment manufactured by SPEEDFAM. The system can be used to grind, lap and polish semiconductor substrates with exceptional precision and surface finish. The unit features a dual motor CNC controlled high speed spindle that can operate up to 40000 RPM. This allows for high speed grinding and lapping processes in customer-defined CNC programs and provides exceptional accuracy and surface reliability. A variety of lapping plates offer precise control of finish, texture, roughness, and lapping slope. The machine also features a tensionless conditioning tool for enhanced surface finish that helps reduce grinding and lapping cracks. 50 GPAW-TD is equipped with a variety of diamond and diamond-coated abrasive grinding wheels. This allows users to grind and lap substrates to precise dimensions with minimal loss of integrity. The adjustable spline segments allow for reliable alignment of the grinding and lapping wheels, enabling users to produce high repeatability results. The asset also features an auto-loading unit, which reduces manual intervention and allows consistent in-process quality control. An adjustable abrasive concentration control can also be used to customize the grinding and lapping process. A PLC-controlled vacuum model accommodates up to 24 sample holders which enhances efficient use of the wafer grinding process. The vacuum equipment is also integrated with a sturdy jackup system that grips and lifts wafers during the grinding and lapping process. SPEEDFAM 50 GPAW-TD is equipped with an efficient dust extraction unit that prevents dust and debris contamination of the wafers. The machine is also equipped with a safety louvre that provides added protection against debris and maintenance of a clean tool. The asset features a process cycle with step-by-step guidance to allow for fast setup and easy operation. 50 GPAW-TD is ideal for high precision grinding and lapping of a variety of flat, and spherical substrates - delivering high quality surfaces with low fast warm up time and low power rating.