Used SPEEDFAM 50 GPAW #9267589 for sale

SPEEDFAM 50 GPAW is a wafer grinding, lapping and polishing system that can produce superior flatness and parallelism on wafer surfaces. It is capable of producing any combination of double-side grinding and single-side lapping and polishing processes within a single process. It achieves high performance and operability by combining an optically-controlled ultra-precision table and grinding/lapping/polishing head with stable, high power spindle motors. 50 GPAW is designed to process semiconductor wafers with a diameter of up to 200 mm and an overall thickness of up to 50mm. It offers high accuracy, with flatness and parallelism in the nanometer range and profile accuracy in the sub-micron range. The grinding head of the machine consists of an ultra-precision spindle motor, which is capable of rotating up to 9500 rpm, and a fine-granularity motion control that enables precise positioning of the grinding wheel. It is capable of producing optimal grinding performance with minimal thermal deformation due to temperature variation and high accuracy due to its superior mechanical design. Its lapping head features a newly-developed lapping plate, which provides high flatness accuracy and a low thermal deformation rate. It also utilizes an internal pressure system, which is capable of producing optimal contact pressure with a single operation. The polishing head enables homogeneous polishing of complex surfaces, using a polishing pad that can be adjusted to product any desired profile. SPEEDFAM 50 GPAW is designed for efficient operation, with an automated loading/unloading system, automatic grinding/lapping/polishing head control and cutting parameter adjustment. Its human-machine interface enables easy operation and enables users to quickly achieve the desired results. 50 GPAW is an ideal solution for grinding, lapping and polishing wafers. It offers superior accuracy, high output, versatile work processes and efficient operation.