Used SPEEDFAM 50 GPAW #9294579 for sale

SPEEDFAM 50 GPAW is a state-of-the-art wafer grinding, lapping & polishing equipment designed to produce extremely precise surfaces on a variety of wafer types. This advanced system is capable of producing superior surfaces with excellent surface finish and flatness. 50 GPAW is a one-of-a-kind machine that combines high-power grinding, lapping, and polishing. It features a precision abrasive grinding wheel powered by a high-torque motor and two separate, controllable spindles. This machine offers a wide range of processing speeds from 0-6,500 RPMs and powers from 0.25-50 HP, allowing it to quickly and accurately process wafers of various sizes and materials. In addition, SPEEDFAM 50 GPAW is equipped with an automated spindle float adjustment to ensure consistent grinding and polishing results. 50 GPAW utilizes adjustable platen pressures to provide precise control over the grinding, lapping, and polishing process. Its platen pressure adjustment range is 0-3,000 PSI and can be adjusted in increments of 5 PSI. Additionally, SPEEDFAM 50 GPAW is outfitted with precision laser and visual alignment systems to ensure accurate grinding and polishing techniques. This unit also features a variety of wafer load insert systems to ensure the safest and most effective loading and unloading of different wafer types. It is capable of accommodating substrates from 0.25" to 12" in diameter and wafer thickness ranging from 0.5mm to 3 mm. Finally, 50 GPAW is equipped with an advanced process monitoring machine to ensure that the grind, lap, and polish processes are consistently reproduced. SPEEDFAM 50 GPAW is the perfect solution for manufacturers who are in need of precise, high-performance wafer grinding, lapping, and polishing process. This advanced tool offers a variety of features, including laser and visual alignment systems, adjustable platen pressures, and an automated spindle float adjustment. Its various wafer loading insert systems enable the safe and secure handling of different wafers and its process monitoring asset ensures that the grind, lap, and polish processes are consistently reproduced. With its high-power grinding, lapping, and polishing capabilities, 50 GPAW is undoubtedly the perfect solution for any wafer processing needs.