Used SPEEDFAM 50 GPAW #9294582 for sale

SPEEDFAM 50 GPAW is a state-of-the-art wafer grinding, lapping and polishing equipment that offers superior performance, durability, and flexibility to meet customers' needs. It is designed to provide a high-precision, finely controlled, repeatable process for a wide range of grinding and polishing operations. 50 GPAW is a manual, full-cycle machine that is capable of grinding, lapping, and polishing a variety of wafers. It has an RMR, Rack-Mounted Rotations-Meter, which allow for precision and repeatability when setting up the process for various wafers. Additionally, the system features two (2) pneumatic chuck mechanisms, each designed for different application speeds. This wafer grinding, lapping and polishing unit offers superior versatility, functionality, and control. A variety of options are available, including three (3) grinding/polishing spindles equipped with active and passive grinding/polishing cylinders, as well as a manual height adjustment control. The infeed and outfeed conveyors are height adjustable to accommodate different size wafers. The machine also includes an inbuilt water spray tool for additional cooling and lubrication of the wafers during grinding, lapping, and polishing operations. SPEEDFAM 50 GPAW also includes high-efficiency filters and a dust collector that ensures that there will be no contamination of the surface being lapped/polished. The ergonomic design offers great convenience when loading and unloading wafers, as well as for monitoring and controlling the process remotely. 50 GPAW is extremely reliable, flexible, user-friendly, and provides excellent wafer grinding, lapping, and polishing capabilities. This asset eliminates the need for multiple stand-alone machines that would otherwise be required for different parts of the grinding/polishing cycle. With its user-friendly touchscreen interface, SPEEDFAM 50 GPAW can be easily operated and maintained while delivering superior accuracy and repeatability.