Used SPEEDFAM 50 GPAW #9294584 for sale

SPEEDFAM 50 GPAW is a wafer grinding, lapping and polishing equipment designed for production of thin, high precision wafers. The system features an integrated work tray that holds up to fifty 6-inch wafers per batch to enable efficient batch-type production. The unit also includes an air-bearing type linear spindle that is capable of achieving high stiffness and highest accuracy. The spindle features a patented "Adjustable Automation and Control" machine that provides automatic, precise control over factors such as feed rate, wheel position, number of passes and polishing time for each wafer. The grinding is done on a cast iron fixture using CBN or diamond grinding wheels along with a special paste. The grinding wheels have adjustable radial run-out for precise control on wafer thickness and flatness. The lapping process follows grinding, and is done with various types of polishing cloths and abrasive slurries. The lapping process involves a rotating disc that is also indexable in order to achieve the uniformity of wafer thickness. The polishing process is used to achieve ultra-smoothness, and utilizes a patented SLG (SigmaLink Grind) process that offers excellent surface finishing quality. 50 GPAW also utilizes an automated wafer handling tool that transfers the wafers and lubricants from the grinding and polishing stages to the post-finishing stage. The asset is capable of handling a wide range of wafer sizes up to 6-inch diameters with various thicknesses. The model is safe and user-friendly, and provides high-end finishes with minimal manual intervention. SPEEDFAM 50 GPAW provides the perfect solution for wafer grinding, lapping and polishing. Its high-end technology provides superior results within a short production cycle, ensuring that wafers produced with this machine are highly precise and of the highest quality.