Used SPEEDFAM 50 SPAW #293723765 for sale

SPEEDFAM 50 SPAW Equipment is a uniquely designed, high speed grinding, lapping & polishing system capable of precision grinding of glass, silicon and ceramic wafers up to 6 inches in diameter. This unit features superior spindle technology with Variable Speed Frequency Inverter and Brushless DC Motors that provide adjustable speeds between 1,000 and 35,000 rpm. 50 SPAW features a two-station, high-torque, stainless steel, planetary-gear driven spindle, powered by a three-phase Brushless DC motor. This motor is capable of producing up to 12kw of torque and features a variable speed frequency inverter which allows the user to adjust the spindle's speed anywhere between 1,000 and 35,000 rpm. This allows for ideal grinding and polishing of the wafer surfaces. The two-station design also allows the user to quickly alternate grinding and polishing operations and minimize downtime. SPEEDFAM 50 SPAW is further equipped with a five-axis machine head, allowing for full 5-axis grinding and polishing for complex compound plane shapes. The C-axis of 50 SPAW's machine head is adjustable from 0 to 5 degrees to ensure maximum precision grinding. SPEEDFAM 50 SPAW is also equipped with a multi-position chuck for optimal wafer loading and clamping. The chuck is capable of accepting up to six 6-inch diameter wafers at a single time and can be easily exchanged for even greater versatility. The control machine of 50 SPAW features a unique wafer control algorithm which optimizes the grinding and polishing processes and ensures maximum precision. Furthermore, SPEEDFAM 50 SPAW determines the necessary grinding and polishing speeds for wafers with varying thickness and composition by using a patented Human-Machine-Interface (HMI). This adjustable algorithm allows for fully automated grinding and polishing sizes on a wide range of materials. In conclusion, 50 SPAW tool is a state-of-the-art, high-speed wafer grinding, lapping & polishing asset, suitable for a wide range of wafer sizes and materials. Its superior spindle and multi-axis grinding capability, variable speed and adjustable polishing algorithm make it an ideal choice for any precision wafer application.