Used SPEEDFAM 50 SPAW #9212225 for sale

SPEEDFAM 50 SPAW is an advanced wafer grinding, lapping, and polishing equipment designed to provide maximum quality at minimum cost. This system is designed for the highest efficiency and lowest cost per wafer per unit production. It is well suited for a wide variety of wafer lapping applications, from polishing to grinding and lapping operations. This unit includes a 50 inch rotating table which spins at a speed controlled by a microprocessor. A customized spindle, controlled by a servo motor, is responsible for controlled wafer grinding and lapping operations. This table also has adjustable tilt angles which can be set in order to maximize wafer grinding quality and production. 50 SPAW can hold up to eight wafers at a time, enabling higher capacity processes. In addition, the machine has an adjustable platen pressure plate for optimal results. The lapping portion of the machine utilizes a combination of diamond and Silicon Carbide abrasives to allow for precise grinding surfaces. The abrasive are typically employed in a loose micron layer and the exact size of the abrasive particles depends on the nature of the job being done. SPEEDFAM 50 SPAW also includes a diamond compound, allowing the user to select the desired quality of finish. A vacuum chuck is also built into the machine, enabling dust and debris removal. An air-cooled motor and fan keep the motor cool during grinding operations. The machine can also be monitored remotely via the included remote control panel, allowing the user to program the tool and monitor operation in real-time. Overall, 50 SPAW is an advanced solution for wafer grinding, lapping and polishing operations. It is designed for maximum efficiency and quality as well as low cost per wafer per unit production. This asset is able to perform a wide variety of tasks and is well suited for a large number of applications including grinding, lapping, and polishing of wafers.