Used SPEEDFAM 50G #9377485 for sale

SPEEDFAM 50G is a high-end wafer grinding, lapping, and polishing equipment designed for efficient fabrication of semiconductor products with the highest standards of accuracy and repeatability. The system is based on a dual-head polishing mechanism which allows for simultaneous grinding and polishing of up to two wafers at a time--enabling faster production rates and increased throughput. The grinding heads are equipped with diamond-impregnated pins for long-lasting abrasive action without the need for frequent maintenance and replacement. The lapping head is mounted on a precision-controlled motorized spindle that maintains a constant rotational speed. As the wafer passes between the lapping head and the platen, the diamond pins rotate against the rotating wafer surface,polishing it to the desired degree of accuracy. The controls of the unit use an advanced closed-loop algorithm which adjusts the lapping and polishing speed depending on the load-signal and wafer torque, monitoring the entire process for optimum results. 50G is designed to handle a wide variety of wafer materials and can easily be adapted to different applications through a variety of control, accessory, and polishing options. The machine is designed to maximize material utilization and reduce process waste, helping to lower overall production costs. Its robust construction and high-quality components provide consistent and reliable performance over prolonged periods of use. Additionally, the tool is designed to be both portable and easy to maintain, with minimal downtime and quick set-up times, ensuring maximum uptime and increased production efficiencies.