Used SPEEDFAM 52 SPAW #9073253 for sale

SPEEDFAM 52 SPAW is a versatile wafer grinding, lapping and polishing equipment designed to offer high-precision surface processing for a range of applications. It provides state-of-the-art technology for demanding wafer grinding and polishing of semiconductor device substrates, ceramic wafers, optical materials and piezoelectrics. The system consists of two units: a top-mounted holder which houses the drive motors and tensioners, and a lower-mounted counter-rotating wafers grinding section built with an optional speed-stabilizing unit. The holder is mounted on a rigid column and has an operator-controlled speed adjustment control, allowing for highly precise surface grinding and polishing. A circular pre-load bearing minimizes vibration, and a powerful continuously variable-speed drive motor ensures precise material removal even at high speeds. The lower-mounted counter-rotating wafers grinding section is equipped with two vertically adjustable high-precision diamond grinding and polishing heads. The diamond heads feature a flexible backing plate for superb concentricity. The polishing head is adjustable with an operator-controlled speed adjustment control, allowing for precise repetition and uniform results while removing material. 52 SPAW also includes a choice of friction, striction and high-pressure wafer grinding and lapping plates for the ultimate in polishing performance. Additionally, the machine is designed to accept grinding and polishing coolant, ensuring a consistent grinding and polishing environment throughout the entire job. SPEEDFAM 52 SPAW is incredibly precise and highly efficient, making it ideal for a variety of wafer grinding applications, including semiconductor device substrates, ceramic wafers, optical materials and piezoelectrics, for stunning results every time.