Used SPEEDFAM 59 SPAW #9073254 for sale

SPEEDFAM 59 SPAW
ID: 9073254
Single side polisher (2) PP Forced drives (2) PP Dead weight type.
SPEEDFAM 59 SPAW is a wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. It is a multi-axis system that can process up to 11 wafers simultaneously. With its high-precision low-vibration operation, it can perform lapping, polishing and flatness measuring in a single operation. 59 SPAW is equipped with five servo-driven axes. The X, Y, Z-axes enable three-dimensional movement and rotation of the grinding/polishing head; in addition, a B- and an A-axis enable four-dimensional marking and 45 degree positioning in the X and Y directions respectively. The two additional A-B axes allow for the processing of full-surface area grinding or polishing. SPEEDFAM 59 SPAW offers a dust-free environment with a completely enclosed chamber. It is fitted with air-pressure and humidifiers, making it suitable for grinding and polishing under low-temperature and high-humidity conditions. The integrated extraction and recirculation unit provides for overall cleanliness and air quality control. The unit is suitable for the grinding and polishing of single- and multi-crystalline wafers. It accommodates eight types of grinding discs, resin-bond diamond discs, abrasive grinding corners and ultrasonic cutting discs, making it suitable for various specific applications. Additionally, it uses an inkjet dispenser for precise application of grinding/polishing compounds to the workpiece. 59 SPAW offers ease of integration with existing lines. It is highly programmable, allowing users to save recipes and setup parameters as per their requirements. An optional Auto Load/Unload machine helps with batch processing and routine jobs. It also features an external diagnostic port for easy remote maintenance. In conclusion, SPEEDFAM 59 SPAW is an efficient and reliable wafer grinding, lapping and polishing tool for the semiconductor industry. It offers excellent precision, ease of operation, and a fully enclosed chamber for dust-free operation. The additional features, such as the Auto Load/Unload asset, the inkjet dispenser, the optional A-B axes, and the external diagnostic port, make 59 SPAW a great choice for challenging wafer processing applications.
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