Used SPEEDFAM 5B-7L #9276666 for sale

SPEEDFAM 5B-7L is a wafer grinding, lapping and polishing equipment designed to deliver high precision processing solutions for applications such as photonics, MEMS, medical devices and other micro-scale products. The system provides an efficient way to finishCMP and semi-conducting substrates. It is composed of 4 main components: grinding unit, lapping unit, polishing unit and vacuum and shower unit. The grinding unit is an advanced 5-axis with high accuracy motions, allowing it to attain sub-micron precision for wafer surfaces. It can be used with two types of grinding wheels - diamond and CBN - and uses up to two independent motors, ensuring a smooth and consistent structure of the wafer surface. The unit is also equipped with an adjustable automatic power control feature, which cancels the uneven movement of the grinding axis due to wheel unbalancing. The lapping unit is designed for cylindrical and flat surfaces lapping. While abrasive stones are used to control the lapping process, a wide range of abrasive slurry is available to suit lapping process requirements for a variety of substrates. The lapping unit also features an automatic adjustment of the grinding wheel speed, offering precise control over lapping parameters and providing the highest possible accuracy and surface finish. The polishing unit's main purpose is to achieve a glossy, high quality finish on the wafer surface using a variety of polishing materials and techniques. Different types of polishing methods - such as slurry dispersion, buffering and pad conditioning - can be combined to achieve the desired results. Finally, the vacuum and shower machine is responsible for cleaning the entire wafer during processing by removing the debris generated by all the grinding, lapping and polishing processes. A single dust collection source is used, significantly reducing the need for maintenance.The tool benefits from efficient suction capabilities and quickly removes the dust particles without degrading the performance of the entire asset. 5B-7L is an excellent choice for anyone looking for a solution to their wafer grinding, lapping and polishing requirements, offering unmatched precision and top-of-the-line production rates. By employing all these different features and components, the model is able to deliver excellent quality products.