Used SPEEDFAM 5B-8L-I #9208858 for sale

SPEEDFAM 5B-8L-I wafer grinding, lapping, and polishing equipment is an automated, self-contained, and integrated processing system designed to polish wafers with the highest precision. This is done through combining the unique features of the polishing head, which includes a highly efficient cutting profile, with an independent spindle drive. The unit also features a modular design to allow for the easy addition of new tools and upgrades. The machine is designed with a stationary wafer chuck coupled to an adjustable spindle, allowing for precise selection of the grinding parameters. The spindle is capable of various speeds ranging from 0 - 3,500rpm and can feed the wafer onto the grinding head with a maximum of 0.1mm of accuracy. The grinding head consists of a rotating diamond disc that is driven by an adjustable speed motor capable of achieving angles of up to 70 degrees. This ensures that the grinding force is directed evenly across the wafer's surface, increasing the uniformity of the cut. The precision of this tool is made possible through its adjustable depth gauges, which allow for a constant and consistent depth of the cuts across the wafer. The lapping stage of the asset is driven by two servomotors which guide the lapping disc, a silicon carbide grit paper, across the wafer surface. The lapping speed is adjustable and can range from 0-2000rpm. This stage is controlled by a pneumatic control model, which offers a high degree of accuracy and uniformity in the controlled lapping operations. The polishing stage of the equipment is enabled by a hydraulically power driven platen which ensures a smooth reciprocation of the table, providing a uniform finish. The platen is capable of performing different passes, adjustable from 0 to 15. During polishing, the surface is lubricated with a water-based liquid applied by a pump on a constant flow to prevent occurrences of polishing defects. The system also includes a digital encoder which accurately controls the rate of the reciprocating motor during polishing, allowing for even and smooth results. By utilizing the features within 5B-8L-I wafer grinding, lapping, and polishing unit, surfaces can be consistently and accurately polished to high-finish requirements with fast operation speeds and excellent control over processes. Hence, this machine is the perfect choice for customers with high-efficiency demands and looking to achieve the best results.