Used SPEEDFAM 5B-8L-I #9257680 for sale

SPEEDFAM 5B-8L-I equipment is a wafer grinding, lapping, and polishing system designed to deliver fast and accurate results. It is equipped with a 5-axis CNC control that provides precision direction control of the grinding process. This allows for higher accuracy and repeatability, ensuring consistent product quality. The machine is capable of grinding large wafers separate from single parts. The 5-axis CNC control also enables the machine to be used for backside grinding, which is necessary for high-end applications featuring hardened substrates. The round grinding part of the unit can hold wafers up to 8 inches in diameter. It rotates the wafer on a vertical axis at high speeds, performing the operation with very high accuracy. The round lapping part can also hold up to 8-inch wafers and apply a range of grooves, arcs, contours, and reverse bevel shapes to the surface. It is equipped with a programmable controller, enabling automatic part recognition for quick setup and operation. Additionally, it allows for manual control, allowing the operator fine-tune the process to meet customer demands. The flat lapping part of the machine is designed to provide maximum accuracy when lapping flat substrates. It is furnished with a pneumatic clamping unit which can quickly secure the wafer in the correct position. The flat lapping part can work with wafers as wide as 8 inches and can handle depths up to 0.060" (2 mm). It is capable of producing a range of features such as straight lines, circles, arcs, rectangular shapes, square holes, reverse bevel shapes, and keyways. The pneumatic clamping also provides the ability to produce multiple part iterations without recalibration. The polishing part of the tool applies the final finish to the ground and lapped surfaces. It is equipped with a programmable controller that can quickly set up for a variety of shapes, such as rectangles, circles, and arcs. It can handle substrates as thick as 0.080" (2mm). SPEEDFAM polishing asset provides superb performance and consistent polishing results. The combination of speed, accuracy, and repeatability make 5B-8L-I model an ideal choice for high-end precision wafer grinding, lapping, and polishing operations. It is capable of producing high-quality surfaces with very tight tolerances and roughness requirements. Its variable speed allows for different materials and workpiece sizes to be processed quickly and efficiently. Finally, the 5-axis CNC control offers a wide range of motion, enabling precise and accurate operation for high-end wafer grinding, lapping, and polishing applications.