Used SPEEDFAM 5B-8L-II #9181282 for sale

SPEEDFAM 5B-8L-II is a state-of-the-art wafer grinding, lapping, and polishing equipment designed for high-precision material removal. It enables the user to achieve a precise lapping and polishing operation with outstanding surface profile tolerances and high chip production yields. The system is equipped with a range of features that ensure repeatable results regardless of material type or amount of material being processed. 5B-8L-II is equipped with a dual-stage grinding process and a precision closed-loop spindle motor that allows for high-precision operation. The grinding spindle is supplied with adjustable speed and feed rate settings, as well as adjustable grinding depth accuracy. SPEEDFAM 5B-8L-II also features a built-in and programmable HPLC injection unit for rapid, automated flow control during grinding operations. The machine is also equipped with an automated sample handler and a fully integrated on-board monitoring tool. The built-in onboard-monitoring asset allows for the detection of anomilies during the lapping and polishing process, ensuring that unwanted material is not removed during the operation. 5B-8L-II is equipped with a variety of high-precision lapping/polishing tools, including a diamond polishing disk, a diamond abrasive grain, a PVB (pressure velocity boost) lapping plate, and an expanded lapping batch option. The diamond polishing disk is designed to provide optimum surface finish, while the diamond abrasive grain is suitable for rapidly removing surface layers from the substrate material without significant damage to the underlying substrate. The PVB lapping plate can be used to obtain a consistent finish on large areas and the expanded lapping batch option allows for additional lapping operations to be integrated into the same model. SPEEDFAM 5B-8L-II includes a wide array of features, such as automated sample loading and unloading, automated tool-change systems, automated process control, and integrated data recording and analysis capabilities. The user can also program and store different grinding and polishing recipes within 5B-8L-II's programming and control equipment. All of these features ensure maximum precision and repeatability during wafer grinding, lapping, and polishing operations. SPEEDFAM 5B-8L-II is the perfect solution for precision wafer grinding, lapping, and polishing. Its advanced features and built-in monitoring systems ensure maximum precision and repeatability when processing a variety of materials. 5B-8L-II's high-precision, automated tools and integrated data analysis capabilities make it an ideal choice for wafer grinding, lapping, and polishing operations.