Used SPEEDFAM 5B-8L #9276626 for sale

SPEEDFAM 5B-8L is a precision lapping and polishing machine designed for industrial applications. It is manufactured by SPEEDFAM Corporation, a leading manufacturer of precision systems for products such as semiconductor wafers, jewelry, and medical instruments. 5B-8L is a standard size machine, capable of grinding, lapping, and polishing 8 inch wafers. SPEEDFAM 5B-8L is an automated equipment featuring a series of five precision lapping stages. The first stage utilizes diamond abrasive to provide a flat, smooth, and precise surface finish. The second stage employs a lapping process to smooth the diamond abrasive finish, and create a nearly mirror-like reflective surface. The third stage utilizes a polishing wheel to remove micro-scratches, while the fourth stage is a cleaning station to remove all the residue left from lapping process. The fifth and final stage is an inspection process, which checks for accuracy and quality. The system can be programmed to utilize multiple forms of abrasive materials, which allows for a custom approach for any desired surface finish. 5B-8L has the ability to process multiple wafers at once, with a maximum speed of 14 per hour. The machine is equipped with a monitoring unit, which enables it to make minute adjustments to the process, ensuring the best possible end result. Its CNC-based design offers superior accuracy at every stage of the lapping and polishing process. SPEEDFAM 5B-8L is constructed from high-grade stainless steel, making it strong and durable. In order to ensure a safe and quiet environment, 5B-8L features an enclosed chamber and a noise control machine, allowing for quiet operation. The machine also comes with an operator-friendly control interface, featuring an LCD monitor for easy monitoring of the process. SPEEDFAM 5B-8L delivers consistent results, offering a long-lasting, repeatable finish across multiple materials. With its easy operation, precise results, and convenient design, it is an ideal machine for achieving precise results with wafer grinding and polishing.