Used SPEEDFAM 5B-8L #9276627 for sale

SPEEDFAM 5B-8L is a high-performing wafer grinding, lapping, and polishing equipment designed specifically for today's requirements in the Semiconductor manufacturing sector. This system is a highly versatile tool that allows users to quickly and efficiently carry out a range of operations on wide range of materials. It features a robust, heavy-duty cast iron construction with a small footprint that makes it suitable for use in a wide range of industrial applications, including R&D, production and process engineering. The machine includes a large grinding wheel with the appropriate grinding wheel speed, precision and fine control. In addition, 5B-8L has a heavy-duty spindle, flexible two-axis swivel heads and multiple rotation speeds, allowing for a wide range of grinding types and sizes. The unit also includes a lapping disc and a polishing disc with separate speed profiles, both of which are equipped with a wheel interface to enable different grinding patterns. The machine is compatible with a range of different materials, including Silicon, gapless silicon and metallic substrates, and is capable of high-precision machining with a repeatability accuracy that exceeds 0.08 mm. Its high-precision micro-adjustment device provides an accuracy of 0.02 mm. SPEEDFAM 5B-8L features a user-friendly, intuitive interface, making it easy to operate even for beginners. The tool is also equipped with several safety features to ensure the operator's safety. Its cooling asset also allows for a wide range of operating conditions, while the model's sealed cover prevents dust from reaching its sensitive components. In addition, 5B-8L is engineered with a high-performance vacuum equipment and exhaust chute to capture the chips generated during machining. This feature not only improves safety and keeps the work environment clean but also helps extend the life of the grinding wheels. The system includes a wide range of quality control measures, including in-flight monitoring, automated grinding endpoints and unit-level diagnostics. Overall, SPEEDFAM 5B-8L is a high-performance wafer grinding, lapping and polishing machine that is perfect for any semiconductor production line. With its robust construction, versatile grinding capabilities, user-friendly interface and high-precision accuracy, the tool is designed to meet the demands of today's semiconductor manufacturing.