Used SPEEDFAM 625 TFG #9251412 for sale

SPEEDFAM 625 TFG Wafer Grinding, Lapping & Polishing equipment is a full featured machine designed for the high-precision grinding, lapping, and polishing of wafers and other substrates. It utilizes a high-speed, durable, and reliable spindle motor to generate accurate and consistent results over extended working periods. This system offers up to 60,000 RPM, generating speeds up to 5 times faster than traditional systems. It also includes an advanced grinding wheel for higher rate of material removal and superior polishing and lapping results. SPEEDFAM 625TFG unit employs an infeed machine for controlling the speed of wafer rotation, which maintains the wafer's uniform surface. This tool also boasts a high-efficiency dust collection asset that allows for improved environment and longer work periods. It also has automated data collection capabilities that help to monitor process results, generate reports, and optimize production quality. Additionally, 625 TFG model runs on a graphical user interface that allows for easy operation and remote access capability. 625TFG equipment offers an array of wafer holders for a range of wafer sizes and types. Standard dry grind wafer holders are available for thin wafers, as well as a standard wet grind wafer holder for larger wafers and flat surface grinding. The dry grinding, lapping, and polishing wheel heads offer versatility for wafer grinding, lapping, and polishing of various materials, including alumina, diamond, and silicon carbide. This system also features a range of media heads for optimal material removal. Overall, SPEEDFAM 625 TFG Wafer Grinding, Lapping & Polishing unit is a reliable and efficient solution for precise wafer processing. It offers high-precision grinding, lapping, and polishing, as well as a wide range of wafer holders, grinding, and polishing heads. It also offers automatic data collection, remote access operations, and auto-feed infeed wheel for increased uniformity in wafer surface treatment. SPEEDFAM 625TFG Wafer Grinding, Lapping & Polishing machine is an ideal choice for any industry requiring high-accuracy wafer processing.