Used SPEEDFAM 625 TFG #9294972 for sale

SPEEDFAM 625 TFG is a powerful wafer grinding, lapping and polishing equipment designed for precision flat surface fabrication on semi-conductor substrates. The system offers maximum throughput, high reliability and low noise performance. The large capacity feature ensures that even large substrates can be processed quickly and efficiently. The machine has a sturdy work bench that carries two grinding heads, two polishing pads, and a lapping station. The grinding heads are equipped with high-pressure cooling jets, allowing for precise removal and uniformity of the substrate surface. The polishing pads are designed to minimize removal and polishing time while maximizing surface quality. The lapping station allows for the rotation of the substrate, which helps to produce uniform surfaces. SPEEDFAM 625TFG offers a wide range of speed control, from 0-40,000 rpm. With its high speed and high precision, the unit can easily grind and lap wafers with even smallest details. The machine also comes equipped with sensors that monitor grinding and lapping conditions and provides feedback in real-time. This helps optimize the process for consistent high-quality results. The control panel allows the operator to program all settings and operation parameters, ensuring that all operations are tailored to meet customer requirements. The control has an intuitive user-friendly interface and allows simultaneous operation of both grinding and lapping processes. The software can also store process data for continual tracking and analysis. 625 TFG is powerful, versatile, and precise wafer grinding, lapping and polishing tool that offers high-speed performance, precision, and reliability. With its high capacity and range of settings, it can be used for a variety of applications and delivers consistently excellent results.