Used SPEEDFAM 625 TFG #9395217 for sale

SPEEDFAM 625 TFG is a wafer grinding, lapping and polishing equipment which has been specifically designed for the semiconductor industry. This system was designed with the aim of achieving superior quality and throughput performance in semiconductor applications due to its robustness and versatility. SPEEDFAM 625TFG is an advanced wafer grinding unit that offers precise and consistent grinding results for the production of semiconductor dies and wafers. This machine features a high-precision grinding wheel, an advanced CNC control software, and a two-axis grinding table for superior control. This tool also has an integrated lapping and polishing station, which allow it to offer maximum efficiency and accuracy for polishing activities. 625 TFG is designed to provide high-precision grinding and polishing of semiconductor wafers and dies. The grinding wheel of the asset has been optimized for both abrasive and non-abrasive materials. It offers an optimal edge radius and grinding pressures, ensuring superior results even with thin and fragile components. The CNC control model features a user-friendly interface, automatic parameter adjustment, and an array of graphical displays. This equipment can be programmed for grinding, lapping, and polishing of multiple semiconductor dies, saving time and effort. The lapping and polishing station of 625TFG can accommodate up to eight rotary lapping plates and four polishing pads. It also features an automatic polishing process control system for maintaining perfect surface finish. This unit is capable of precise edge control, capable of producing excellent flatness and squareness. Additionally, the machine also offers enhanced accuracy and repeatability, enabling consistent results for every part. In addition, SPEEDFAM 625 TFG is equipped with a full range of safety features an interlocked safety grating, E-stop, and braking of the grinding wheel for maximum safety. The tool also features an optional cooling asset to protect sensitive components from excessive heat buildup during the process. Overall, SPEEDFAM 625TFG is an advanced wafer grinding, lapping and polishing model designed for superior performance in the semiconductor industry. It provides precise grinding, lapping, and polishing operations to deliver superior results. Additionally, its enhanced safety features helps ensure improved operator safety and machine security.