Used SPEEDFAM 64 BAW #9226536 for sale

SPEEDFAM 64 BAW is a wafer grinding, lapping and polishing equipment designed for the rapid and accurate manufacturing of wafer surfaces. It is a high-capacity, automated system with a small footprint and a powerful user interface, designed to simplify and streamline the grinding, lapping and polishing process. 64 BAW has a grinding capacity of up to 64 4-inch wafers and a maximum band width of 0.25mm. It features a precise, five-axis motion control unit with a high-speed 7-axis table, for precise high-speed grinding, lapping and polishing. The table is equipped with a precision positioning machine that allows the table to rotate in three directions with fine step resolution. SPEEDFAM 64 BAW utilizes a diamond wheel lead finish technology that results in superior surface quality. The high-precision lead finish grinds with a free surface and an even surface roughness, which is significantly better than manually produced surfaces. It also employs a magnetorheological fluid damper tool that helps reduce noise and vibrations while grinding. The asset comes with a range of process parameters that can be adjusted to best suit customer needs. It can be programmed to automatically adjust grinding, lapping, and polishing parameters, that help maintain consistent surface quality and minimize cycle time. 64 BAW model is fully automated and ready for operation in a cleanroom environment, with Class 100 and Class 1000 cleanliness standards. It also features a hazardous environmental protection, avoiding contact with wafer particles, thus minimizing contamination and air particle contamination. SPEEDFAM 64 BAW is an efficient and reliable equipment that allows for high-volume grinding, lapping and polishing of semiconductor wafers and other substrates. Combined with its intuitive user interface, efficient automation and hazardous environmental protection, it is an ideal system for the production of wafer surfaces with superior surface quality and minimal cycle time.