Used SPEEDFAM 64 BSW #293606142 for sale

ID: 293606142
Vintage: 1999
Lapping machine P/N: 64BSW466801-2412 Plate diameter, 60" Inside ring diameter, 22" Total ring area: 1810"² Plate speed: 45 RPM Cylinders diameter, 6" Down pressure per head: 1900 lbs Main drive motor, 15 HP Diameter segmented lapping plate, 64" (4) Geared conditioning rings (4) Air pressure hold downs with plates Push button control station Manuals included 1999 vintage.
SPEEDFAM 64 BSW wafer grinding, lapping and polishing equipment is a high-precision, automated, closed-loop machine for achieving low average roughness and surface smoothness on large semiconductor wafers and flat surfaces. It is ideal for creating very smooth, low scratching surfaces on large components (up to 300mm in diameter) that require high-end, precision surface finishes. 64 BSW incorporates an innovative design platform that allows high efficiency processing and is highly reliable. Its advanced motion control system allows precise programming and repeatable results, while the high-end air bearing spindle produces vibration-free operation for maximum efficiency and consistency. The process-driven control unit allows for easy operator interface and operation, complete with automatic self-diagnostics and analysis to ensure maximum performance. The open-loop control machine allows for flexibility in work processes. Built-in power monitoring tool further increases reliability. For greater process accuracy, SPEEDFAM 64 BSW includes a vacuum chuck for improved workpiece holding and includes integrated cooling for local and global temperature control of the wafer. The closed loop control asset is accurate over long periods and provides monotonic repeatability. In addition, 64 BSW utilizes a choice of Grinding, CMP and Polishing process technologies including diamond and alumina abrasive disks, a natural lubricant model and a sink-in finishing action. The effective and efficient materials powers the equipment with adequate force and is able to deliver an ideal surface finish quality. SPEEDFAM 64 BSW is designed to operate at a high level of quality and efficiency while maintaining availability at a low cost of ownership. Highly accurate and precise, the system is able to produce highly reliable, repeatable and low-scratches surfaces on a substrate. The result is a smooth, flat surface with a consistent and tolerable size, shape and form. The machine provides cost-effective solutions for producing high-quality, precise components for the medical, automotive, and consumer electronics industries.
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