Used SPEEDFAM 6B-11P-IV #9400317 for sale

ID: 9400317
Lapping machine.
SPEEDFAM 6B-11P-IV is a wafer grinding, lapping and polishing equipment which uses advanced concepts and technology to deliver high precision and surface finish. This system includes a wide variety of tools and accessories to achieve maximum efficiency and performance. 6B-11P-IV includes a main body which contains several grinding/lapping tools including a main grinding wheel and a high-speed polishing unit with diamond impregnated heads. The grinding wheel is adjustable for different process parameters and is available in various types of abrasives such as silicon carbide (SiC), aluminum oxide (Al2O3) and polycrystalline diamond (PCD). The polishing machine features an automatic exchange mechanism, enabling the operator to quickly switch between lapping and polishing operations. The exchange mechanism also helps to ensure consistent process parameters. This tool also includes a wide range of sub-systems, including a cooling asset, a lapping plate and lapping plate gloves. The cooling model helps ensure optimized speed and abrasive performance and also helps to protect the abrasive grinding/lapping/polishing components from becoming over-heated. The lapping plate and lapping plate gloves are designed to reduce extraction of the abrasive material and help keep the substrates flat. SPEEDFAM 6B-11P-IV has been developed to meet various process requirements. It can achieve a surface finish of < 1 .nm (1 x 10-9mm) or a mirror-like finish on semiconductor surfaces, depending on the application and the required surface specifications. Due to its compact design and low center of gravity, the equipment is highly reliable and easy to operate, even in tight and confined environments. 6B-11P-IV wafer grinding, lapping and polishing system is a robust and high-quality solution for advanced semiconductor processing and finishing applications. Its highly modern technology and features guarantees the highest technical properties, making it a reliable and efficient choice for semiconductor fabrication processes.
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