Used SPEEDFAM 6B-7L/P #9191612 for sale

SPEEDFAM 6B-7L/P is a wafer grinding, lapping, and polishing equipment that provides superior wafer surface finish and performance. It is well-suited for use in the manufacture of semiconductor and optoelectronic devices, such as GaAs, InP, and GaN devices. The system utilizes a combination of a diamond impregnated grinding wheel, a specialty lapping head, and a polishing head to achieve due to its process control, fast cycle times and uniformity of each wafer surface. SPEEDFAM 6B-7L/P unit is a full-featured solution, with machine features including a direct drive spindle, programmable grinding and lapping force, precision Z-axis motion and a multi-function auxiliary head. The machine also features a smart fixturing tool that supports quick loading of wafers, a touchscreen interface and built-in tutorials for quick setup and operation. The grinding head utilizes diamond abrasive for maximum grinding efficiency, and the lapping head utilises a proprietary Verification Plus™ head for uniform lapping surfaces. The polishing head includes an easy-to-operate, automated recirculation asset, which helps to regulate pressure, speed and airflow. SPEEDFAM 6B-7L/P is also engineered to incorporate cleanroom friendly features, such as an adjustable particle mist separator, an enclosed metal housing, and closed loop pump oil sprayer. In addition, the model features process parameters to accommodate different wafer materials, resolutions, and optimized cycle parameters. SPEEDFAM 6B-7L/P includes setup individual setup profiles for each wafer, enabling improved consistency and quality assurance. It also provides online data tracking for all process parameters, aiding in machine maintenance, troubleshooting, and process repeatability. Additionally, SPEEDFAM 6B-7L/P helps to reduce waste by utilizing a self-cleaning recirculation equipment and automatic dust collection. SPEEDFAM 6B-7L/P is a robust and highly versatile wafer grinding, lapping, and polishing system. It is well-suited to producing high-quality wafers with an optimized finish, uniformity, and a consistent form factor. With its cleanroom friendly features, intuitive touchscreen controls, and fully automated operation, it is a reliable and powerful solution for the grinding, lapping, and polishing of semiconductor and optoelectronic components.