Used SPEEDFAM 84 BAW #9207276 for sale
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ID: 9207276
Single side lapping machine
Equipped with:
(4) Pneumatic hold down plates
With variable hold down pressure
(4) Retainer rings
Water cooled: 84" Segmented lapping plate
Adjustable inner gear drive
Slurry pump and tank
Specifications:
Plate diameter: 84"
Retaining ring ID: 32-1/2"
Total ring area: 3318 Sq. in
Plate speed variable: 0-36 RPM
Main drive: 25 HP
Cylinder size: 8"
Down pressure (Variable): 0-3400 lbs
1972 vintage.
SPEEDFAM 84 BAW is a high-precision wafer grinding, lapping and polishing equipment that is designed to achieve superior quality results with each application. The machine utilizes a combination of abrasive and chemical processes to achieve a smooth, glossy finish on the wafer's surface. The system is automated; the user simply loads their substrate onto the unit's grinding table and sets the desired parameters, and the machine takes care of the rest. The operator can adjust the grinding process to suit specific demands, and parameters can be altered in the middle of the process, if needed. 84 BAW uses a series of coarse and fine diamond wheels, lapping and polishing tapes, and slurries, as well as a rotating mechanical polisher to achieve the desired result. The abrasive materials are applied with different loads, grinding speeds and time settings to ensure a uniform finish throughout the application. The machine is designed to produce a non-warped surface with a flatness of less than 1um and a reduced surface roughness of ≤ 0.04um. The machine is equipped with a fully automated oscillation mechanism that allows it to grind and polish multiple substrates of different sizes and thicknesses simultaneously. It also features a post-processing transparent adhesive tool, enabling samples to be quickly removed after processing. In addition, the platform is equipped with a wide range of sensors for temperature, pressure, and water supply to ensure optimal operation and results. SPEEDFAM 84 BAW is equipped with a graphical user interface for easy monitoring and control. The dashboard allows for the selection of grinding parameters, the initiation of operation sequences, and the evaluation of processing information. Moreover, the asset integrates a range of safety features for the protection of operators and operation processes in the event of hardware or software malfunction. Overall, 84 BAW is a powerful piece of equipment for grinding, lapping and polishing wafers for multiple applications, allowing for greater accuracy and repeatability. Its automated model, wide range of sensors, adjustable parameters, and intuitive graphical interface ensure it is efficient and reliable.
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