Used SPEEDFAM 8B-5L-IV #293634647 for sale

SPEEDFAM 8B-5L-IV equipment is a computer-controlled, automated solution for wafer grinding, lapping, and polishing. It is designed to offer fast, accurate and low-cost performance for those in the semiconductor, wafer, and component production industries. This system utilizes a variety of grinding, lapping, and polishing heads which are attached to an innovative work table. The work table is segmented into eight separate work stations, each of which is equipped with adjustable force loaders and micro metrical drives. It also features adjustable pressure, vibration and speed settings, allowing operators to achieve precise surface properties. The unit has five individual process stages: rough grinding, polishing, lapping, micro-jet polishing, and inspection. A variety of wafers can be worked on, including those made from silicon, gallium arsenide, ceramic, and quartz. Specialized polishing abrasives, such as diamond and ceramic powders, are used to refine the surface of each wafer. In addition, the machine features built-in software that allows for precise control over the grinding and polishing process. 8B-5L-IV also provides a high level of safety and ergonomics. An intuitive graphical user interface makes it easy to operate, while a soundproof cabinet ensures noise levels are kept to a minimum. Automatic water reservoir provides humidity control and coolant for the grinding and lapping process. SPEEDFAM 8B-5L-IV is a reliable and cost-effective solution for wafer grinding, lapping, and polishing. It is designed to offer precise control over the process, while being easy to use and maintain. There are also various options available, including additional grinding heads, a portable dust collection tool, and a wide range of customized abrasives and chemical compounds. As such, it is a valuable tool for any industrial or commercial setting that requires precise grinding and polishing of wafers.