Used SPEEDFAM 9 B 5 LP #9187785 for sale
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ID: 9187785
Lapping machines
Down force range: 0-113 Kg
Plate dimensions: 630 dia x 245 dia x 30T
Crosscut spacing width: 25 x 25, 1.5 mm
Lower plate RPM: 7-60 rpm, 50/60 Hz
(5) Carriers
Carrier specification:
DP= 12
Z= 105
PCD= ψ228.6
Ring gear specification:
DP= 12
Z= 314
PCD= ψ664.6
Sun gear specification:
DP= 12
Z= 98
PCD= ψ207.4
Lifting cylinder: SCA-FAψ100 x 375st
Pressure control cylinder: ψ80 x 80st
Main drive motor: 2.2 kW
Slurry motor: 0.4 kW
Air supply: 4-6 Kg / cm^2 13 l/m
No grinding disc
No mud supply motor
Dimensions:
Max diameter available for lapping: DIA.ψ150 mm
Min thickness available for lapping: 0.15 mm
Max thickness available for lapping: 25 mm.
SPEEDFAM 9 B 5 LP is a robust, low profile, 5-disc wafer grinding, lapping & polishing equipment perfect for high volumes of production. This grinding system uses five bench-mounted, abrasive grinding disc stations to grind and lap the front and backside of workpieces simultaneously. An independently driven disc spindle can precisely control the speed, pressure and force of each station. This enables a high level of accuracy and precision throughout the entire process. SPEEDFAM 9B-5LP is built with a durable and reliable construction featuring a strong base frame. It has a smooth, vibration-free operation and a low floor-profile design, allowing it to easily fit into a variety of production environments. Advanced electronics are built-in allowing for precise control of the process and automatic detection of any changes in conditions. To optimize grinding performance, 9B-5L/P is equipped with special PLC software. This software monitors the end-point, making the unit more efficient and precise while offering long-term reliability. It also includes intuitive displays, touch controls and audio messaging, enabling easy and precise operation. This machine also features temperature control and external cooling water supply, ensuring optimal working conditions and reducing temperature-induced deformation. Coolant feed and filtering are also included for increased safety and better performance. 9 B 5 LP is powered by a hydraulic, closed-loop servo drive tool that ensures precise motion and elimination of backlash. The speed of each disc is precisely controlled to perfectly adapt to the application, with speeds ranging from 0 up to 2000 RPM. Furthermore, it is designed to work with diamond, silicon dioxide and boron-containing polishing slurries and pastes, allowing it to work with a wide range of workpiece materials. SPEEDFAM 9B-5L/P is a robust, reliable and precise wafer grinding, lapping & polishing asset, perfect for high-volume production. Its strong frame, temperature control and external cooling water supply, PLC software, intuitive controls and a robust servo drive model guarantee maximum precision while ensuring the highest levels of safety and reliability.
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