Used SPEEDFAM 9B-14P #9170539 for sale

SPEEDFAM 9B-14P is a multi-purpose wafer grinding, lapping and polishing equipment. It is designed to provide accurate, high-precision, metalworking operations for advanced semiconductor wafer processing. 9B-14P consists of a rotary grinding/cutting table, a fixed-speed gear system, a fast-acting lapping and polishing spindle, a high-precision control unit, and an optional digital display control panel. The rotary grinding/cutting table features an extended range of feed rate and spindle speed, allowing for precise automated processing of wafers. Its high-speed gear machine ensures extreme precision and vibration-free operation. The tool's lapping and polishing spindles are designed to perform multiple types of operations on the wafer surface, providing superior surface quality. The spindles are also equipped with adjustable grinding/lapping plates for greater control and accuracy. In order to ensure optimal adjustment for varying material types and levels of surface finish, SPEEDFAM 9B-14P incorporates a digital control panel. This display panel can be used to adjust the finer details of the wafer processing asset, such as feed rates, spindle speeds, and the size and position of grinding/lapping plates. 9B-14P offers several advantages over traditional manual wafer grinding and polishing systems. It provides excellent surface finish quality, along with a greater degree of control and accuracy. Additionally, the model eliminates manual labor and improves overall efficiency. Overall, SPEEDFAM 9B-14P is highly effective for processing advanced semiconductor wafers. It offers advanced grinding and lapping capabilities at high speeds, allowing for the production of superior-quality surfaces with minimal effort. Additionally, its digital display control panel allows for precise adjustment of feed rates, spindle speeds, and grinding/lapping plates. Therefore, the equipment is ideal for obtaining advanced surface finishes with superior accuracy and repeatability.