Used SPEEDFAM 9B-5 #293606725 for sale

SPEEDFAM 9B-5 is a multi-purpose wafer grinding, lapping and polishing equipment used in the semiconductor industry. It uses a series of planetary spindles to grind, lap, and polish wafers of any size or material, including quartz, ceramic, or silicon. It is an advanced form of grinding and polishing, used to achieve a higher level of wafer finish than basic polishing abrasive wheels can offer. 9B-5 consists of a mainframe, a motor controller and an optional power supply. The mainframe is a robust and reliable steel structure that houses the grinding and polishing planets, sample holders, and accessories. The motor controller provides speed and heat control, allowing for precise performance on each of the three grinding, lapping, and polishing phases. The optional power supply is used to provide optimal current for the grinding and polishing actions, ensuring efficient wafer processing. SPEEDFAM 9B-5 is capable of handling a very wide range of wafer sizes, from as small as 1mm to as large as 200mm. Additionally, the system can be configured for either a two-planet or three-planet set-up in order to meet the requirements of specific processing tasks. The two-planet unit is ideal for single- or dual-sided wafer grinding, while the three-planet machine is necessary for multi-task polishing cycles. All planets are highly adjustable, allowing for easy and accurate set-up of the tool for both grinding and polishing operations. 9B-5 is equipped with a wide range of accessories that expand its versatility. Automation capabilities, such as a robot loader, allow it to accommodate larger production runs. Additionally, options such as a spin chuck or vacuum chuck improve the accuracy and repeatability of wafer processing. The asset is also equipped with a wide variety of grinding and polishing abrasives, allowing for optimal performance on a wide range of wafer materials. SPEEDFAM 9B-5 provides users with an efficient and reliable solution for grinding, lapping, and polishing of a wide range of wafer materials at high speeds. Its advanced features make it an ideal tool for achieving cost savings, reducing labor costs, and improving production quality.