Used SPEEDFAM 9B-5 #293798806 for sale

SPEEDFAM 9B-5 is a wafer grinding, lapping and polishing system produced by SPEEDFAM Corporation. It is designed to provide high precision wafer polishing and uniformity for automated semiconductor manufacturing processes. 9B-5 has seven process heads, including grinding, lapping and polishing heads, which rotate at precisely regulated speeds. The disc-type grinding head employs a rotating diamond abrasive wheel and a planetary gear driver to achieve higher grinding/polishing speeds and better surface finish results. The wafer is held firmly between the two heads, while the grinding disc and planetary gear drive rotate at a programmed RPM, bringing the wafer into contact with the grinding wheel. The lapping head features an oscillating lap wheel and a counterweight system, to provide more efficient and precise lapping compared to conventional rotary systems. The lapping wheel is adjustable in both its speed and stroke rate, allowing for precise control over the process. The lapping wheel also utilizes a diamond abrasive to ensure consistent results and high precision. The polishing heads provide the final step in the process, ensuring the highest level of surface finish. SPEEDFAM polishing head is designed to accommodate different wafer sizes and thicknesses. The head utilizes an oscillating pad and a planetary gear drive to provide the highest precision and accuracy. For improved results, the head is designed to rotate at precisely regulated speeds. SPEEDFAM 9B-5 is designed for the production of high precision wafer grinding, lapping and polishing. It has a modular design, allowing for the addition of multiple process heads and providing greater flexibility. The system also employs advanced digital measuring tools and computer controlled electronic/mechanical systems, to ensure high precision and repeatability. Overall, 9B-5 offers optimal wafer processing performance, including efficient grinding and lapping, high precision polishing, and uniform surface finishes.