Used SPEEDFAM 9B-5 #9199871 for sale
URL successfully copied!
Tap to zoom
SPEEDFAM 9B-5 Wafer Grinding, Lapping and Polishing equipment is a robust, user-friendly system that specializes in the polishing of round wafers. With a variety of features, 9B-5 is an effective solution for fast, precise polishing of opto-electronic components, medical implants, MEMS, and other advanced materials. The unit contains a wafer loading station, grinding station, lapping station, and polishing station. The wafer loading station allows for the transfer of wafers onto the grinding and polishing disks. The grinding station utilizes precision-engineered diamond wheels to shape the wafers into their desired shape. With an adjustable speed control and coolant machine, grinding can be carried out efficiently and with minimal thermal deformation. After the shaping is complete, the lapping station uses the same diamond wheels to finish the surfaces and edges of the wafers to a mirror finish. At the polishing station, a polishing plate spins to polish the substrate using tailored slurry, which can be adjusted for each wafer. Additionally, SPEEDFAM 9B-5 also includes an adjustable support holder which helps with wafer alignment and holds the wafers without surface deformation. As a user-friendly tool, 9B-5 features an intuitive touch-screen interface for simple operation. Additionally, SPEEDFAM 9B-5 contains an automated deburring asset that removes particles and residues created during grinding and polishing. The model is also designed with safety in mind, and includes emergency stop buttons and operator-friendly safety guards. Overall, 9B-5 is a highly precise equipment that provides maximum accuracy and repeatability during wafer grinding, lapping, and polishing of round wafers. With adjustable speeds, automated deburring, and intuitive controls, SPEEDFAM 9B-5 is a reliable solution for a wide variety of applications.
There are no reviews yet