Used SPEEDFAM 9B-5 #9265418 for sale
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ID: 9265418
Double sided lapping machine
With precision load cell and auto part thickness controller
Proface color touch screen controls cutting edge
Sub cylinder for very accurate down pressure control
Splash guard system
(3) Motor drive system
With 4th motor power elevation
Minimum thickness: 0.007"
Motor: 5 HP
Stainless sun gear
Splash guard system with (4) sliding doors
landing pressure consistently
Down force range: 0 -111 kg
Precision load cell for accurate control
With down force of upper plate
Stainless steel ring gear
Lap diameter: 24.4"
Carrier diameter: 9"
Lower plate: 5-60 RPM
Sun gear: 3-30 RPM
Ring gear: 4-30 RPM
Stainless steel package:
Rear gear
Sun gear
Upper assy
Drive hub
Main top cylinder and precision sub cylinder included
Spare parts.
SPEEDFAM 9B-5 is a wafer grinding, lapping, and polishing equipment used to achieve superior part quality and improved throughput. It is an economical wafer processing system designed for high-performance, high-volume operations. 9B-5 is capable of grinding and polishing single and double-sided wafers, as well as performing lapping and polishing processes up to 8 inches in diameter. It is designed to produce complex shapes and surface finishes with low roughness values (Ra<10nm). The unit also supports dry and wet grinding processes, allowing for quicker process times and improved throughput. SPEEDFAM 9B-5 is designed to provide superior part quality in a variety of industries, including medical, wafer, and LED applications. Its modular design allows for flexibility and customization to meet the specific needs of the customer. Operations are automated through a graphical user interface (GUI) control machine. This tool offers a variety of features including programmable recipes, real-time process monitoring, and automatic control setup/programming. This GU can also be used to set the rough and finish grinding parameters as well as track the entire process from start to finish. 9B-5 has numerous features and benefits that enable it to be used for high-volume, high-performance operations. It has an efficient design with high-speed wafer grinding and polishing capabilities that can be customized to meet the unique needs of the customer. Its user-friendly user-interface ensures an easy set-up and flexibility to continually adapt to changing production requirements. SPEEDFAM 9B-5 is a reliable, high-performance asset with a compact footprint, making it an ideal solution for high-volume wafer processing. With its reliable and precise performance, 9B-5 is an excellent choice for achieving superior part quality and improved throughput.
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