Used SPEEDFAM 9B-5L-4 #9086162 for sale

SPEEDFAM 9B-5L-4 is a wafer grinding, lapping and polishing equipment used to create high-quality, defect-free surfaces on semiconductors and other wafers. This system is capable of handling a variety of wafer sizes and processes with the use of dedicated fixtures and accessories. 9B-5L-4 unit consists of a large main component and several smaller accessories. The main component is the head, which consists of a 5-axis grind/polish spindle and a buelt type wheel. The combination of the two creates high velocity cut, permitting a wide variety of wafer sizes to be efficiently processed. The high velocity cut also creates high quality surfaces with minimal contamination. In addition, the head has a pressure regulatable range of 0-300PSI to precisely adjust the contact during grinding and lapping. Additionally, the machine is equipped with a variable speed middle tension lap for precise lapping and polishing. This lap can accommodate both conductive and non-conductive materials with the use of specific grinding and polishing fluids. As a result, this tool is suitable for a variety of lapping and polishing applications. The asset also enjoys an easy-to-use duty cycle control with step-by-step operation for best grinding results. It has a sophisticated 2-D display for intuitive machine operation and is compatible with a wide variety of software used to control and adjust the machine's status and performance. Additionally, the model is designed to maintain low acoustic levels during operation to minimize noise emissions. SPEEDFAM 9B-5L-4 equipment Set is also designed to ensure productivity and performance. It is backed by a comprehensive warranty that covers the machine and its accessories. Furthermore, it is compatible with a wide range of abrasive media for different applications, allowing for precise system tuning and process setup. With its variety of features, 9B-5L-4 unit is ideal for the creation of high-quality, defect-free surfaces on a variety of semiconductor wafers and other materials.