Used SPEEDFAM 9B-5L-42 #9224846 for sale

SPEEDFAM 9B-5L-42 is a high-performance wafer grinding, lapping and polishing equipment manufactured by SPEEDFAM International Incorporated. It's widely used for telecom, power device, MEMS, MEMC, SOI, and Wafer Level Optics industries. This system is equipped with five lapping plates—4"x2", 6"x3" or 8"x4"—and mounted on two three-head configurations. The first configuration is 5L-42N, and it includes a closed, variable-flow circulating lapping oil unit as well as a low-powered brush to clean the plates in between lapping cycles and prep the wafer. The second configuration is 5L-42C, and it includes a coolant circulation tank and fan cooling instead. Both configurations have a 36" grinding wheel driven by a ½ HP motor, a 420mm Idler Table driven by a 1 HP motor, digital tensioning unit, a Lapping/Polishing Platen for special grinding and polishing steps, and a Powder Bubble Machine for deburring. The 5L-42 tool offers excellent lapping accuracy, with lapping precision up to ±1µm; high removal rate, with grinding speeds up to 2µm/sec; and automated operation, with an intuitive 9" color touchscreen for easy operation, and a programmable logic controller (PLC) for control and data logging. Additionally, the asset boasts a robust design, making it suitable for all types of wafers. A number of customizable options can also be added to 9B-5L-42, including a rotating conveyor for wet and dry processing, a wafer chuck and a CPU-based control station. The model also features modular construction, making it easy to upgrade to more powerful components and features like a sensor head computer interface and automated wafer loading and unloading systems. Overall, SPEEDFAM 9B-5L-42 is a reliable, ergonomic equipment that offers superb lapping accuracy, high removal rates, advanced automation and a range of customizable options. Used in a variety of industries, this system provides reliable performance for those looking for ultimate precision when grinding, lapping and polishing wafers.