Used SPEEDFAM 9B-5L-II #9276629 for sale

SPEEDFAM 9B-5L-II is a high-performance wafer grinding, lapping and polishing equipment designed to deliver superior results. This system has an adjustable analog lapping plate movement speed of 1 - 20 RPM, a digital stepper motor µ-step 10nm - 200nm, and variable stroke down to 2nm. This versatile unit is able to grind with up to 5 tools simultaneously, providing users with greater speed and efficiency. In addition, 9B-5L-II is capable of continuous average cycle times and uniform grinding/lapping of wafers up to 4 inches diameter within 1um of flatness. SPEEDFAM 9B-5L-II is designed for flexibility and features an adjustable diamond grinder head, pressure regulated step loading and unloading zones, and a motorized wafer isolation sled. The machine also has an integrated Long Term Monitoring (LTM) tool with on-board touch screen control and a PC with software for data analysis and presentation, as well as an optional in-situ flatness measurement asset. 9B-5L-II wafer grinding, lapping and polishing model is built with a durable steel frame, to provide an ergonomically-friendly workspace and protect against corrosion, vibration, and other adverse factors. This equipment also has a wet coolant filtration and recirculation system for added safety, and an automated leakage safety check unit. As an added convenience, SPEEDFAM 9B-5L-II offers an easy-to-use "operational guide" for efficient maintenance and repair. 9B-5L-II is a robust and versatile machine specifically designed for wafer grinding, lapping and polishing. This advanced tool provides superior wafer polishing solutions for a wide array of industries, from consumer electronics to medical devices, ensuring consistent and reliable results.