Used SPEEDFAM 9B-5L-III #9311816 for sale

SPEEDFAM 9B-5L-III is a precision wafer grinding, lapping and polishing equipment. Designed for the processing of large 3"-5" semiconductor wafers, the system is capable of achieving high geometric accuracy and surface finish in a single, high-speed operation. The unit also features a fully automated control machine, incorporating advanced machine functions, that enables precision control and engineered processing. SPEEDFAM 9 B 5 L III utilizes a process of forced abrasive contact, allowing for simultaneous single-pass machining of a wafer's both sides to achieve profile and parallelism. The tool's unique design allows for controllable rotation speed, pressure and feed rate, resulting in precision control of parameters. The forced abrasive contact is powered by a 2.7- hp DC servo motor and is combined with an adjustable tooling fixture to ensure secure, consistent wafer processing. 9B-5L-III includes a Programable Logic Controller (PLC) to monitor and regulate automated operations. The asset also includes automatic cycle controls and a quadrant array spindle-head design. This design minimizes corner polishing, aiming to eliminate operator interference and ensure uniformity across the wafer surface. The model's real-time graphical user interface (GUI) is designed to provide extensive operator feedback and control, and the integration of a powerful work processing and asset monitoring equipment ensures efficient, repeatable operations. 9 B 5 L III includes an extensive range of abrasives available for customization, allowing operators to easily select the best processing conditions according to application. The system is also designed to be easily maintained and serviced due to its robust construction, advanced drive technology, and modular design. SPEEDFAM 9B-5L-III is ideal for high precision-polishing and grinding applications that require high surface finish and geometry accuracies, providing reliable repeatability and superior performance. With a throughput capacity of up to 900 wafers per hour, the unit is able to increase productivity and reduce operational costs.