Used SPEEDFAM 9B-5L-IV #9181275 for sale

SPEEDFAM 9B-5L-IV is an automated equipment for wafer grinding, lapping, and polishing. It's a five-axis system that provides the highest accuracy and repeatability for the most demanding applications. It offers three levels of grinding, lapping, and polishing for silicon and other delicate substances, including diamond and SiC. 9B-5L-IV unit is designed to work with semiconductor wafers and execute demanding grinding and polishing operations on them. This machine uses an advanced kinematic logarithmic positioning tool (KLPS). It uses three axes to move the tool head and two additional axes to position the workpiece, while maintaining precise control. This allows for the desired geometry and precise finish of the wafer. The KLPS control asset also utilizes 3D interpolation features enabling the machine to trace irregularly shaped wafers. SPEEDFAM 9B-5L-IV has a robust motorized spindle ideal for high-precision grinding, lapping, and polishing applications. It is equipped with a load cell for monitoring the clamping force. This ensures that the materials are not damaged by over-clamping. The spindle's oil-cooling feature ensures that the unit does not overheat during operations. The selection of grinding/polishing discs range from 50um - 0.2 μm (super-finition) for fine grains, and to 25 - 250 μm for coarse stocks. It supports direct diamond plated lapping plates that facilitate an efficient grinding process. 9B-5L-IV also supports computer numerical control (CNC) enabling automatic grinding, lapping, and polishing processes. The model's built-in CCD fixture camera can capture images of the grinding/polishing wafer, allowing users to monitor the quality of the operation. Its easy-to-use software provides users with various parameters like auto alignment, profile setting, edge detection, and so on, to facilitate the operations. In addition, the unit is equipped with a built-in oil mist cleaner, which filters out small particles of grinding product and dirt which can adhere to the instrument during the grinding process, ensuring a clean operation. All these features are combined in SPEEDFAM 9B-5L-IV equipment, making it a competitive choice for state-of-the-art wafer grinding, lapping, and polishing operations.