Used SPEEDFAM 9B-5L-IV #9181276 for sale

A SPEEDFAM 9B-5L-IV is a sophisticated wafer grinding, lapping, and polishing system used primarily in semiconductor manufacturing processes. It features a fully automated reliability which is capable of treating a wide variety of materials and shapes. This system consists of several components that work together to effectively grind, lapping and polishing the wafer. This includes a robot arm to move the wafer stage, a grinding, lapping, and polishing chamber, a spinning wheel, and an in-line weighing bridge for monitoring process data. The robot arm is used to carefully move the wafer stage into the grinding, lapping, and polishing chamber. The chamber is temperature controlled to ensure that the materials remain in their ideal condition while they are treated. Inside, the chamber also contains a spinning wheel which rotates the wafer beneath the wheels to grind and polish it. The grinding, lapping, and polishing chamber has adjustable settings to control the speed and pressure applied to the wafer. The pressure applied to the wafer can be adjusted to ensure that the correct amount is applied based on the material of the wafer. This helps to ensure that the best possible results are achieved during the process. After the treatment process is complete, the wafer stage is moved out of the chamber and the data collected is checked. The in-line weighing bridge measures the amount of material removed from the wafer during the grinding, lapping, and polishing process. This data is then used to the verify that the correct pressure was applied during the treatment process. By using 9B-5L-IV, manufacturers can be sure that their processes are efficient and reliable. The ability to control the pressure and speed used during the process as well as the ability to measure the amount of material removed from the wafer allows for consistent results across all manufactured products. This makes SPEEDFAM 9B-5L-IV an invaluable tool in the modern semiconductor industry.